Intelligent multi-Wire Saw Machine
DSY-XJ3011
Structure Features
Achieve high-speed cutting, with a cutting speed of up to 40m/s.
Adopt advanced servo system complete solution, the system is stable and reliable.
The main cutting structure adopts steel structure, the overall operation is stable, and the structural deformation is small.
The main motor adopts direct drive structure, and the operation process is precisely controllable.
The servo motor is used to control the tension, which can achieve a tension adjustment accuracy of ±10N.
The U-shaped guide wheel layout, the whole machine structure 4 guide wheel structure, improves the stability of the cutting line.
The cutting feed adopts a two-axis linkage screw structure, and the servo drive feed speed is adjustable.
6 Advantages
High production capacity: saw seam 0.5mm, yield rate exceeding 97%.
Ultra thin: capable of processing 5mm thick ultra-thin slabs.
Environmental protection: Reduce stone waste by over 80%.
Safety: high precision, never pulling the board.
Noise reduction: No vibration, noise reduction of over 40 decibels.
Space saving: reduce land size for erecting machine by more than 30%.
Application
Solar Panel Manufacturing: Efficient processing of thin silicon wafers for photovoltaic cells.
Semiconductor Manufacturing: Precise cutting of semiconductor materials to minimize material loss.
Advanced Composite Materials: Handling composite materials that require precise and clean cutting.
Technical parameters
Application
Solar Panel Manufacturing: Efficiently process thin silicon wafers for photovoltaic cells.
Semiconductor Fabrication: Cut precise semiconductor materials with minimal material loss.
Advanced Composites: Handle composite materials requiring precise and clean cuts.